Redefining Image Sensing
At Essens IC, we design high-performance image sensors to solve your toughest imaging problems.
Get in TouchWho We Are
ESSENS IC is a Leuven-based semiconductor design company specialized in high-performance image sensor solutions for industrial, scientific, medical, and security market. The ESSENS IC founding team brings over 40 years of combined experience in image sensor design and technical leadership, backed by more than 40 publications in the field of sensing and over 40 patents from previous roles, demonstrating both deep expertise and a strong track record in innovation. Our expertise includes advanced pixel architectures and specialised analog and digital processing, ensuring fast integration of our sensors into customer systems.
Our Mission
Image sensors are fundamental to today's society, enabling everything from quality control in manufacturing, diagnostics in medical devices, safety in transportation, to automation in agriculture and smart cities. As these applications grow in number and importance, the demand for image sensors is increasing dramatically.
At Essens IC, our mission is to bring high optical performance to industrial, scientific, and medical imaging without the complexity that typically comes with it.
We focus on designing essential, robust IP blocks that are simple to integrate, reliable in operation, and optimized for manufacturability. This approach allows us to deliver plug-and-play image sensors that offer high yield, lower system costs, and accelerated time to market for our customers.
By simplifying complex technologies, we are enabling the next wave of Industry 4.0 where intelligent machines, automation, and data-driven systems rely on sensors that just work.
What Sets Us Apart
We combine deep industry experience in designing and leading full image sensors with a strong culture of innovation to deliver cutting-edge solutions. Our IP design services and custom products are personally managed and designed by our principal-level engineering team, ensuring expert guidance and the highest quality throughout every stage of development. We have all the expertise in-house, from photon detection to digital output, everything is handled directly by us.
Our Services
From foundational image sensor IPs to full custom sensor development and EOL-compatible replacements, we cover the full image sensor lifecycle.
IP Design Services
We design all analog and digital IP blocks present in image sensors, starting from pixels, to analog and digital signal processing blocks till digital sequencer and output interface. Our expertise covers the following IP blocks:
- GS/RS, HDR pixel architectures
- Ramp-based ADCs: down to 20µV noise, down to 1µm pitch, less than 1µs 12b digital CDS conversion time
- Compact, low power analog IPs: PMU, BIAS, bandgap
- Digital processing
- SLVS, LVDS, CML interfaces
Custom Sensor Design
We design custom image sensors for all your challenging needs. Even if your request sounds impossible, don't hesitate to reach out to us. We can customize your sensors for scientific, industrial, security and other markets with unique performance parameters:
- Down to 20µV RMS noise readout circuitry for deep sub-electron imaging
- 12-bit ramp ADCs with sub 20ns row time thanks to high parallelism
- Ultra-low-power consumption for weight and reliability improvement
- Single-shot HDR sensing with both RS and GS pixel topologies
- Multi-stacked technology image sensors (up to triple stacking)
EOL-Compatible Replacement
Has your sensor of choice reached end of life? We can help you seamlessly replace the sensor with a newer one:
- Pin-compatible sensor redesigns
- Maintain footprint, optics & IO interface
- Maintain or improve optical performance (QE, noise, etc.)
- Maintain or improve electrical performance (lower power, removal of external passive and active ICs, etc.)
- Improve yield and reliability
Our Competence
Our founding team brings a unique and comprehensive expertise in leading chip designs from initial architecture definition all the way through to block-level design, chip validation, test and qualification. We have a successful track record in product designs across application fields such as scientific, consumer, and industrial. We have extensive experience collaborating with the major foundries in the imaging domain, working on technologies ranging from classic front-side illuminated (FSI) ones (350nm, 180nm, 110nm and 65nm), back-side illuminated (BSI) ones (180nm and 65nm) to advanced 3D stacking (45nm + 40nm, 65nm + 65nm).
Front-side Illumination
Back-side Illumination
3D Stacked
Contact Us
Email us at
info@essens-ic.com
Follow us on
LinkedIn
Office Location
Professor Roger Van Overstraetenplein 5
3000 Leuven
Belgium